Parameters/Test Conditions | Symbol | Limits | Units | |
---|---|---|---|---|
Drain-Source Voltage | VDS | 80 | V | |
Gate-Source Voltage | VGS | ±20 | V | |
Continuous Drain Current3 | TC = 25°C | ID | 50 | A |
TC = 100°C | 31 | |||
Pulsed Drain Current1 | IDM | 90 | ||
Continuous Drain Current | TA = 25 °C | ID | 10 | |
TA = 70 °C | 8.7 | |||
Avalanche Current | IAS | 49 | ||
Avalanche Energy | L = 0.1mH | EAS | 120 | mJ |
Power Dissipation | TC = 25 °C | PD | 50 | W |
TC = 100 °C | 20 | |||
Power Dissipation | TA = 25 °C | PD | 2.3 | W |
TA = 70 °C | 1.5 | |||
Operating Junction & Storage Temperature Range | TJ , Tstg | -55 to 150 | °C |
Thermal Resistance | Symbol | Typical | Maximum | Units |
---|---|---|---|---|
Junction-to-Ambient2 | RΘJA | 53 | °C/W | |
Junction-to-Case | RΘJc | 2.5 |
1. Pulse width limited by maximum junction temperature.
2. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C.
3. Package limitation current is 50A.
Symbol | Parameter | Test Conditions | Limits | Units | |||
---|---|---|---|---|---|---|---|
Min | Typ | Max | |||||
Static | |||||||
V(BR)DSS | Drain-Source Breakdown Voltage | VGS = 0V, ID = 250uA | 80 | V | |||
VGS(th) | Gate Threshold Voltage | VDS = VGS , ID = 250uA | 2 | 3 | 4 | ||
IGSS | Gate-Body Leakage | VDS = 0V, VGS = ±20V | ±100 | nA | |||
IDSS | Zero Gate Voltage Drain Current | VDS = 64V, VGS = 0V | 1 | A | |||
VDS = 60V, VGS = 0V, TJ = 55°C | 10 | ||||||
RDS(ON) | Drain-Source On-State Resistance1 | VGS = 7V, ID = 10A | 7.8 | 12 | mΩ | ||
VGS = 10V, ID = 10A | 7.2 | 9 | |||||
gfs | Forward Transconductance1 | VDS = 5V, ID = 10A | 57 | S | |||
Dynamic | |||||||
Ciss | Input Capacitance | VGS =0V, VDS = 25V, f = 1MHz | 2824 | pF | |||
Coss | Output Capacitance | 322 | |||||
Crss | Reverse Transfer Capacitance | 178 | |||||
Rg | Gate Resistance | VGS =0V, VDS = 0V, f = 1MHz | 0.9 | Ω | |||
Qg | VGS = 10V | Total Gate Charge2 | VDS = 40, VGS = -10V, ID = 10A | 53.2 | nC | ||
VGS = 7V | 40.4 | ||||||
Qgs | Gate-Source Charge2 | 13.5 | |||||
Qgd | Gate-Drain Charge2 | 17.8 | |||||
td(ON) | Turn-On Delay Time2 | VDS = 40V, ID ≌10A, VGS = 10V, RGEN = 6Ω | 35 | nS | |||
tr | Rise Time2 | 40 | |||||
td(OFF) | Turn-Off Delay Time2 | 60 | |||||
tf | Fall Time2 | 40 | |||||
Source-drain Diode Ratings and Characteristics (TJ=25℃) | |||||||
IS | Continuous Current3 | 38 | A | ||||
VSD | Forward Voltage1 | IF = 10A, VGS = 0V | 1.4 | V | |||
trr | Reverse Recovery Time | IF = 10A, dlF/dt = 100A / uS | 34 | nS | |||
Qrr | Reverse Recovery Charge | 37 | nC |
1. Pulse test : Pulse Width ≤ 300 μsec, Duty Cycle ≤ 2%.
2. Independent of operating temperature.
3. Package limitation current is 50A.